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SAMWIN Features N-Channel MOSFET BVDSS (Minimum) RDS(ON) (Maximum) ID Qg (Typical) PD (@TC=25 ) : 600 V : 1 ohm : 7.0 A : 30 nc : 142 W SW7N60 General Description This power MOSFET is produced in CHMC with advanced VDMOS process, planar stripe. This technology enable power MOSFET to have better characteristics, such as fast switching time, low on resistance, low gate charge and especially excellent avalanche characteristics. This power MOSFET is usually used at high efficient DC to DC converter block and switch mode power supply. D G S Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS EAR dv/dt PD TSTG,TJ TL Drain to Source Voltage Continuous Drain Current (@Tc=25) Continuous Drain Current (@Tc=100) Drain Current Pulsed Gate to Source Voltage Single Pulsed Avalanche Energy Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (@Tc=25) Derating Factor above 25 Operating junction temperature &Storage temperature Maximum Lead Temperature for soldering purpose, 1/8 from Case for 5 seconds. (Note 2) (Note 1) (Note 3) (Note 1) Parameter Value 600 7 4.7 28 30 530 14.2 4.5 142 1.14 -55~+150 300 Units V A A A V mJ mJ V/ns W W/ Thermal Characteristics Value Symbol ReJC ReCS ReJA Units Max 0.88 / W / W 62.5 / W Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Thermal Resistance, Junction-to-Ambient Min - Typ 0.5 - 1/6 REV0.2 04.11.1 SAMWIN Electrical Characteristics Symbol Off Characteristics BVDSS BVDSS / Tj IDSS Drain- Source Breakdown Voltage Breakdown Voltage Temperature coefficient Drain-Source Leakage Current Gate-Source Leakage Current IGSS Gate-Source Leakage Reverse VGS=0V,ID=250uA ID=250uA,referenced to 25 VDS=600V, VGS=0V VDS=480V, Tc=125 VGS=30V,VDS=0V VGS=-30V, VDS=0V 600 (Tc=25 unless otherwise noted) SW7N60 Value Test Conditions Min Typ Max Units Parameter 0.67 - V V/ - - 1 100 -100 uA nA nA On Characteristics VGS(th) RDS(ON) Gate Threshold Voltage Static Drain-Source On-state Resistance VDS=VGS ,ID=250uA VGS=10V,ID=3.5A 3.0 0.85 5.0 1 V ohm Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VGS=0V,VDS=25V, f=1MHz 1200 150 18 1500 190 25 pF Switching Characteristics td(on) tr td(off) tf Qg Qgs Qgd Turn-on Delay Time Rise Time Turn-off Delay Time (Note4,5) Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge (Miller Charge) VDS=480V,VGS =10V, ID=7.0A (Note4,5) 52 30 6.5 13 100 nc VDD=300V,ID=7.0A 35 79 80 70 130 ns 240 Source-Drain Diode Ratings and Characteristics Symbol IS ISM VSD trr Qrr Parameter Continuous Source Current Pulsed Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Test Conditions Integral Reverse p-n Junction Diode in the MOSFET Min. - Typ. 320 2.4 Max. 7 28 1.4 - Unit. A IS=7.0A,VGS=0V IS=7.0A,VGS=0V, dIF/dt=100A/us V ns uc NOTES 1. Repeativity rating: pulse width limited by junction temperature 2. L=19.5mH,IAS=7.0A,VDD=50V,RG=0ohm, Starting TJ=25 3. ISD7.0A,di/dt100A/us,VDDBVDSS, Starting TJ=25 4. Pulse Test: Pulse Width300us,Duty Cycle2% 5. Essentially independent of operating temperature. 2/6 REV0.2 04.11.1 SAMWIN 10 VGS top:10V 8V 7.5V 7V 6.5V 6V 5.5V bottom:5.5V SW7N60 10 ID,Drain Current [A] ID,Drain Current [A] 25 C o o 150 C 1 1 Note: 1.250us pulse test 2.TC=25 C o Note: 1.VDS=50V 2.250us pulse test. 0.1 0.1 0.1 1 10 2 4 6 8 10 VDS,Drain-to-Source voltage [V] VGS, Gate-Source Voltage [V] Fig 1. On-State Characteristics Fig 2. Transfer Characteristics 2.5 Drain-Source On-Resistance[ohm] 2.0 VGS=20V 1.5 VGS=10V IDR,Reverse Drain Current[A] 10 150 C 1 o 25 C o RDS(ON) 1.0 0.5 Note:TJ=25 C o Note: 1.vGS=0v 2.250us test 0.0 0 5 10 15 20 25 0.1 0.2 0.4 0.6 0.8 1.0 1.2 ID, Drain Current[A] VSD,Source-Drain Voltage[V] Fig 3. On Resistance Variation vs. Drain Current and Gate Voltage 2000 Ciss = Cgs+Cgd(Cds=shorted) Coss= Cds+Cgd Fig 4. On State Current vs. Allowable Case Temperature 12 1600 10 VDS=480V VDS=300V Crss = Cgd V GS,Gate-Source Voltage [V] Ciss 8 Capacitance [pF] 1200 Coss VDS=120V 6 800 Note: Crss 400 1.VGS=0V 2.f=1MHz. 4 2 Note:ID=7A 0 0 10 20 30 40 50 60 70 0 0.1 1 10 VDS,Drain-Source Voltage [V] QG,Total Gate Charge [nC] Fig 5. Capacitance Characteristics (Non-Repetitive) 3/6 Fig 6. Gate Charge Characteristics REV0.2 04.11.1 SAMWIN 1.2 SW7N60 3.0 2.5 Drain-Source Breakdown Voltage Drain-Source On-Resistance 1.1 BV DSS[Normalized] 2.0 RDs(on)(Normalized) 1.0 1.5 1.0 0.9 Note: 1.VGS=0V 2.ID=250uA 0.8 -100 -50 0 50 100 o 0.5 Note: 1.VGS=10V 2.ID=3.5A 150 200 0.0 -100 -50 0 50 100 o 150 200 TJ,Junction Temperatur [ C] TJ,Junction Temperature[ C] Fig 7. Breakdown Voltage Variation vs. Junction Temperature 8 100 Fig 8. On-Resistance Variation vs. Junction Temperature Operation In This Area Limted By RDS(ON) 6 ID, Drain Current[A] 1ms 10ms DC 1 Note: ID, Drain Current[A] 10 100us 4 2 1.Tc=25C 2.Tj=150C 3.Single Pulse 0.1 1 10 100 1000 0 25 50 75 100 o 125 150 VD,Drain-Source Voltage[V] Tc,Case Temperature [ C] Fig9. Maximum Safe Operating Fig 10. Maximum Drain Current Vs. Case Temperature 1 (t),Thermal Response D = 0 .5 0 .2 0 .1 0 .1 0 .0 5 0 .0 2 0 .0 1 s in g le p u ls e 0 .0 1 N o te : o JC 1 . Z JC ( t ) = 0 . 8 8 C / w M a x 2 . D u t y F a c t o r ,D = t 1 / t2 3 . T j-T c = P D M * Z J C ( t ) Z 1 E -5 1 E -4 1 E -3 0 .0 1 0 .1 1 10 Fig 11. Transient Thermal Response Curve t 1 ,S q u a r e W a v e P u ls e D u r a ti o n ( s e c ) 4/6 REV0.2 04.11.1 SAMWIN Same Type as DUT 300nF SW7N60 VGS 10V Qg Qgs Qgd 50KU 200nF VDS VGS DUT 1mA Charge Fig 12. Gate Charge test Circuit & Waveforms RL VDS VDD (0.5 rated VDS) VDS 90% 10V Pulse Generator RG DUT Vin 10% tf td(off) td(on) tr ton toff Fig 13. Switching test Circuit & Waveforms L VDS VDD BVDSS RG DUT 10V IAS VDD 1 BVDSS EAS= --- LLIAS2--------------2 BVDSS-VDD ID(t) VDS(t) tp Time Fig 14. Unclamped Inductive Switching test Circuit & Waveforms 5/6 REV0.2 04.11.1 |
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